:: Meena Circuits Pvt. Ltd. ::

Services

Engineering

Our team of high rank CAD-CAM engineers and experts with world class training overseas assure seamless transition of customers' engineering data to our manufacturing floor to produce PCBs exactly as per customers' need.

The following information outlines our engineering and manufacturing capabilities.

EData Format Will be Accepted Via Disk, FTP E-Mail & Modem

Gerber | Rs-274-x | DXF | PDF | HPGL | Autacad | ASCII or Ela NCdrill file

CAM Capabilities

	-	Latest software
	-	Micro-modifications performed with customer approval
	-	Panel/array optimization available
	-	Pre-manufacturing design checks on every part
	-	Net list test fixture generation

Process Options

	-	Solder mask over bare copper (SMOBC)
	-	Tin Plating (Electroless/Electrolytic/Immersion)
	-	Carbon ink
	-	OSP
	-	White tin
	-	Solder mask:LPI & SR1000(Green/Blue/Red)
	-	CNC skip scoring
	-	HASL (Hot Air Solder Level)

Process Capabilities

	Laminate types	:
			FR-2,FR-4,FR-406,FR-5,CEM-1,CEM-3,(all UL94V-0-rated),Nelco N4000,Glass epoxy , polyamide laminates

Mechanical Process Tolerances

Minimum annular ring	:	+/-0.005”
Board edge to edge, routed	:	+/-0.005”
Tooling hole to hole	:	+/-0.002”
Hole to hole	:	+/-0.002”
Tooling hole to edge	:	+/-0.005”
Holes to copper registration	:	+/-0.005”
Copper to solder mask	:	+/-0.005”
Holes to legend	:	+/-0.010”
Top to bottom registration	:	+/-0.005”
Image line tolerance	:	90% art work
Edge to copper	:	+/-0.010”
Solder mask clearance	:	+/-0.005”
Minimum hole size	:	+/-0.010
Minimum inside radius	:	+/-0.015”
Minimum trace width	:	+/-0.005”
Hole to hole clearance	:	+/-0.015”
Pad to pad clearance	:	+/-0.007”
Hole to board edge	:	+/-0.020”
Hole diameter	:	+/-0.0025”
Scoring tolerance	:	+/-0.005”